105 of 105 companies
3PEAKAnalog / powerSuzhou-based analog chip designer founded April 23, 2012 with US venture backing and listed on the STAR Market in September 2020. Core products are signal-chain analog ICs (amplifiers, data converters, interface, isolation) and power management ICs, with over 3,000 product types. FY2024 brought a net loss of RMB 197mm; FY2025 revenue rebounded 75.65% to RMB 2.142bn with net profit of RMB 173mm.688536.SSAccoTEST (华峰测控)OtherAccoTEST (华峰测控, 688200.SH), founded in Beijing in 1993, is China's leading supplier of semiconductor automated test equipment (ATE), anchored by the STS8200 analog and mixed-signal tester and the newer STS8600 aimed at SoC and compute chips. FY2025 revenue reached RMB 1.35 billion, up 48.72% YoY.688200.SSACM ResearchDeposition / etchACM Research is a wet-process equipment vendor whose China operating center, ACM Research Shanghai, is one of the more visible domestic challengers in single-wafer cleaning, electrochemical plating, and advanced-packaging wet tools.688082.SSAdvanced Micro-Fabrication Equipment Inc. ChinaDeposition / etchAMEC (Advanced Micro-Fabrication Equipment) is China's flagship etch-tool maker — the company most often cited as proof that China can compete in at least one critical fab-equipment category outside lithography. It was founded in Shanghai in 2004 by Gerald Yin and a team with Applied Materials and Lam Research backgrounds, and has been STAR Market-listed (688012) since 2019.688012.SSAlibaba T-HeadCPUT-Head is a fabless semiconductor design unit of Alibaba Group that develops processor IP and custom chips, deploying silicon primarily inside Alibaba Cloud rather than through broad merchant chip sales. Its RISC-V processor IP is open-sourced to grow an ecosystem, while its AI accelerators and server CPUs serve Alibaba's own cloud infrastructure and AI services.PrivateAnji MicroelectronicsCMP polishing toolsShanghai-based supplier of chemical mechanical polishing (CMP) slurries and functional wet electronic chemicals, founded February 7, 2006 by Shumin Wang and listed July 22, 2019 in the first batch of 25 STAR Market IPOs. FY2025 revenue was RMB 2.504bn, up 36.47%, with net profit of RMB 784mm.688019.SSBiren TechnologyAI acceleratorsBiren is one of China's most visible attempts to build GPU-class chips for AI training and inference.6082.HKBIWIN Storage (佰维存储)MemoryBIWIN designs and sells storage products — including consumer storage devices and enterprise storage solutions — to device manufacturers, channel partners, and enterprise customers. Its Lenovo AI-infrastructure partnership indicates an expansion into server and data-center storage beyond consumer devices.688525.SSBrite Semiconductor (灿芯股份)IP coresBrite Semiconductor (灿芯半导体（上海）股份有限公司), a Shanghai-based one-stop custom-chip (ASIC) design-services and IP provider founded in 2008, listed on the STAR Market in April 2024 (688691.SS). It works deeply with SMIC - whose subsidiary SMIC Holdings held 18.98% pre-IPO as the second-largest shareholder - and ranked around fifth globally in chip design-services share. 2025 saw design activity expand (275 tape-outs, up 45%) while mass-production revenue halved, swinging the company to a net loss.688691.SSCalterahLidar / radarCalterah develops and sells millimeter-wave radar system-on-chip (SoC) products that integrate the radar RF front-end with processing, targeting automotive and sensing customers as a fabless semiconductor supplier.PrivateCambricon TechnologiesAI acceleratorsCambricon is a listed Chinese AI-chip company and a reference point for domestic accelerator commercialization outside Huawei.688256.SSChangchuan Technology (长川科技)OtherHangzhou back-end test-equipment leader founded April 2008, listed on ChiNext in April 2017 (300604.SZ), making IC testers, handlers and probe stations; it acquired Singapore-based STI (AOI-related test business) to broaden its overseas footprint. FY2025 revenue was RMB 5.29B (+45.31% YoY) with net profit up about 190%, led by testers at RMB 3.20B (+55.29%, 60.53% of revenue, 62.25% gross margin).300604.SZChina Wafer Level CSP (晶方科技)Assembly & testThe company provides wafer-level chip-scale packaging (WLCSP) and related advanced packaging services to semiconductor design and manufacturing customers, earning revenue from packaging and assembly service fees.603005.SSChipmore Technology (颀中科技)Assembly & testChipmore (颀中科技, 688352.SH) provides full-process packaging and test for display-driver chips — bumping, wafer test (CP) and COG/COF flip-chip packaging — from bases in Hefei and Suzhou. Its 2024 annual report ranks it first in mainland China and among the global top three in display-driver packaging and test by revenue.688352.SSChipseaMCUChipsea is a fabless semiconductor company that designs and sells analog and mixed-signal integrated circuits — including high-precision ADCs, MCUs, RTC SoCs, and measurement SoCs — to electronics manufacturers, generating revenue from chip sales and design-in activity across consumer, industrial, and IoT end markets.688595.SSCXMTMemoryCXMT is China's leading domestic DRAM maker: a vertically integrated memory company that designs, manufactures, and sells DRAM, with DDR5 and LPDDR5/LPDDR5X in mass production; its parent group listed on the Shanghai STAR Market in July 2026 (688825).688825.SSDawei (大为股份)MemoryShenzhen Dawei Innovation Technology (Dawei Co., Ltd.) was founded in 2000 and listed on the Shenzhen Stock Exchange in February 2008 under its former name Tellerad (特尔佳), when its business was automotive auxiliary braking systems (retarders), a field in which it helped set industry standards. The company renamed itself Dawei in 2020 after shifting to a dual structure of 'semiconductor storage + smart terminals' alongside 'new energy + automotive'. Its storage business is conducted through wholly owned subsidiary Shenzhen Dawei Chuangxin Microelectronics (DW Micro, founded 2011, consolidated after Dawei bought out minority holders of Xinhuiqun Microelectronics in December 2021). By FY2025 storage was the dominant revenue source: RMB 1.10 billion of RMB 1.22 billion total revenue (about 90%), while automotive, new-energy (lithium battery) and smart-terminal hardware made up the remainder.002213.SZDinglong Co.CMP polishing toolsHubei Dinglong, founded 2000 in Wuhan and listed on ChiNext in 2010 (300054), began with toner charge-control agents and has become China's CMP consumables champion: the number-one domestic CMP pad provider with 38.5% China market share by 2025 revenue (Frost & Sullivan) and China's third-largest CMP materials supplier overall, against DuPont's global pad dominance. FY2025 revenue was RMB 3.66 billion (+9.7%) with net profit of RMB 720 million (+38.3%); CMP pad revenue rose 52% to RMB 795 million, and the company filed for a Hong Kong main-board listing in July 2026 to pursue an A+H structure.300054.SZDosilicon (东芯股份)MemoryDosilicon (东芯半导体股份有限公司) was founded on November 26, 2014, headquartered in Shanghai's Qingpu District with branches in Shenzhen, Nanjing, Hong Kong and South Korea, and listed on the STAR Market on December 10, 2021 (688110); SMIC's investment arm participated in 2018. It is one of the few mainland Chinese designers offering small/medium-capacity NAND, NOR, DRAM and MCP products focused on the niche-memory market. FY2025 revenue was RMB 921 million (+43.76%) with a net loss of RMB 195 million; the AI-driven shortage then produced H1 2026 revenue of RMB 1.497 billion (+336.44%) and net profit of RMB 659 million at a 67.66% gross margin. The board approved an H-share listing plan on May 22, 2026.688110.SSEmpyrean TechnologyEDAEmpyrean is China's most important domestic EDA software company, but it is not a one-for-one substitute for Synopsys, Cadence, or Siemens EDA across the full advanced digital design flow.301269.SZEnflame TechnologyAI acceleratorsEnflame is a Shanghai cloud AI-chip startup founded in March 2018 by ex-AMD colleagues Zhao Lidong and Zhang Yalin. Its 邃思 (Suisi) DSA-architecture chips and 云燧 (CloudLight) training/inference cards target cloud inference workloads, with Tencent as largest external shareholder and dominant customer. Its STAR Market IPO (688801) was registered in July 2026 to raise about RMB 6 billion, with preliminary price inquiry on 2026-08-28 and subscription on 2026-09-02.PrivateFudan MicroMCUShanghai IC design company founded July 1998 out of Fudan University; the first Chinese IC design firm to list shares, on Hong Kong's GEM in August 2000 (moved to the HK main board in 2014), and dual-listed on the STAR Market on August 4, 2021. Four main product lines: security and identification chips, non-volatile memory, smart-meter chips and FPGAs. FY2025 revenue RMB 3.982bn, up 10.92%.688385.SSFujian Jinhua (JHICC)MemoryFujian Jinhua is a state-backed integrated DRAM manufacturer that designs and fabricates memory chips at its own fab in Jinjiang, Fujian Province. Its founding mandate was to build domestic DRAM capacity and reduce China's near-total reliance on foreign memory suppliers. After the 2018 US Entity List designation, the business has operated under constrained access to advanced equipment and design tools, limiting production scale.PrivateGalaxyCoreImage sensorsGalaxyCore, founded in 2003 and headquartered in Shanghai, designs CMOS image sensors (CIS) and display driver ICs for smartphones and other volume markets. It listed on the Shanghai STAR Market in August 2021 through a red-chip restructuring and ranked second globally in mobile-phone CIS shipments by volume in 2024. The company is building its own 12-inch BSI wafer line in Shanghai's Lingang area to support its move up-market into high-pixel products.688728.SSGEGVCMP polishing toolsBeijing Jingyi Jingwei is a CMP equipment maker founded in 2019 out of the CMP division of CETC's 45th Research Institute, controlled by China Electronics Technology Group Corporation and backed by National IC Fund Phase II. It is the only Chinese supplier to achieve batch overseas sales of 8-inch CMP tools and also builds 12-inch and SiC-focused 6/8-inch-compatible tools. Its STAR Market IPO passed review in February 2024 but was withdrawn in July 2024 amid questions over heavy revenue dependence on SMIC.PrivateGiantec Semiconductor (聚辰股份)MemoryDesigns and sells EEPROM and related specialty non-volatile memory chips used for data and configuration storage in electronic systems, earning revenue through semiconductor product sales to device and module manufacturers.688123.SSGigaDeviceMCUGigaDevice is a Beijing-headquartered fabless semiconductor company whose value to the tracker is not one heroic frontier chip, but a broad set of memory, MCU, sensor, and analog products that sit close to real electronics demand.603986.SSGpixelImage sensorsDesigns and sells CMOS image sensor chips and imaging solutions for high-performance, non-consumer imaging markets including scientific, industrial, and medical applications.3277.HKHengshuo (恒烁股份)MemoryHengshuo Semiconductor (Hefei) was founded in February 2015 in Hefei, Anhui, and listed on the Shanghai Stock Exchange STAR Market on August 29, 2022 (688416). A fabless chip designer, its revenue comes from NOR Flash memory chips and 32-bit general-purpose MCUs based on Arm Cortex-M0+ cores. Its NOR Flash portfolio spans 1Mb-128Mb, concentrated in mid-to-low density consumer applications; its largest customer is JieLi Technology, which uses Hengshuo 4Mb/8Mb NOR parts in Bluetooth audio chips. FY2025 revenue was RMB 474.6 million with a net loss of about RMB 98 million; the cycle turned sharply in H1 2026 with revenue of RMB 528 million (+203.21%) and net profit of RMB 140 million.688416.SSHesai TechnologyLidar / radarDesigns and manufactures lidar sensors for ADAS and autonomous-driving applications and sells them as hardware to automotive OEMs and mobility/robotics customers; revenue scales with automotive volume-production ramps and design wins, with reported plans to roughly double output in 2026.HSAIHiSiliconOtherHiSilicon is Huawei's in-house chip-design arm, important less as a standalone merchant semiconductor company than as the design engine behind Huawei's device, telecom, optical, and compute platforms.PrivateHua Hong SemiconductorFoundryHua Hong Semiconductor is China's major specialty foundry reference point: less about leading-edge logic than about mature-node and specialty process capacity across embedded NVM, power discrete, analog/power management, logic, and RF.688347.SSHua Li Microelectronics (HLMC)FoundryHLMC operates as a pure-play merchant semiconductor foundry, manufacturing wafers to customer designs and selling wafer fabrication services across its process-technology platforms. It earns revenue from per-wafer production rather than selling its own branded chips.PrivateHuatian TechnologyAdvanced packagingHuatian Technology is a major Chinese OSAT with a useful combination of domestic scale, overseas acquired capacity, and advanced-packaging exposure.002185.SZHuaweiAI acceleratorsHuawei is the closest thing China has to a full-stack semiconductor demand engine: Ascend AI accelerators, Kunpeng CPUs, networking, cloud, devices, and system integration.PrivateHuicheng (汇成股份)Assembly & testHuicheng (合肥新汇成微电子股份有限公司, 688403.SH), headquartered in Hefei, Anhui, provides one-stop display-driver IC packaging and test built around front-end gold bumping, wafer test (CP) and COG/COF packaging. It runs 8-inch lines at its Yangzhou subsidiary and 12-inch lines in Hefei, one of the few mainland OSATs with both.688403.SSHwatsingDeposition / etchTianjin-based equipment maker founded April 2013 to commercialize the CMP research of Tsinghua University's mechanical engineering department (academician Luo Jianbin's team; co-founder Lu Xinchun serves as chairman and chief scientist), listed on the STAR Market in June 2022. It is the only Chinese supplier with 12-inch CMP tools in volume production and sale, and has expanded into wafer thinning, dicing, wafer reclaim and services. FY2025 revenue RMB 4.648bn, up 36.46%; added to the US Entity List on December 2, 2024.688120.SSHygon Information TechnologyCPUHygon is China's leading designer of x86 server CPUs and GPGPU-style DCU AI accelerators. Founded in Tianjin in 2014 under Chinese Academy of Sciences initiatives with Sugon as a founding shareholder, it licensed AMD Zen-era x86 technology through Chengdu JVs in 2016, was added to the US Entity List in June 2019, and listed on the STAR Market in August 2022. FY2025 revenue reached about RMB 14.4 billion, driven by AI demand for its DCU line.688041.SSJCETAdvanced packagingJCET is China's largest outsourced semiconductor assembly and test company and a top-three global OSAT, making it one of the clearest scale anchors in China's back-end semiconductor stack.600584.SSJiaocheng Ultrasonic (骄成超声)OtherSBT (Jiaocheng) Ultrasonic Technology, founded in Shanghai in February 2007 by a core team from Shanghai Jiao Tong University and listed on the STAR Market in September 2022 (688392.SS), builds ultrasonic welding, cutting and inspection equipment for lithium-battery manufacturing, automotive wire harnesses and power semiconductors. Its ultrasonic rolling welders are supplied to CATL for battery-tab welding, and its semiconductor line - aluminum and copper wire bonders, terminal and pin welders, and ultrasonic scanning microscopes - grew revenue 196% in 2024, targeting a market led by K&S and ASMPT.688392.SSJingce Electronics (精测电子)OtherWuhan-based inspection-equipment group founded 2006, listed on ChiNext since November 2016 (300567.SZ), operating across display, semiconductor and new-energy detection systems. FY2025 revenue was RMB 3.35B (+30.51% YoY) with a return to net profit above RMB 80M; the semiconductor segment grew 71.60% to RMB 1.32B and turned profitable at RMB 112M segment profit. The group (Wuhan Jingce Electronic) was added to the US Entity List in December 2024.300567.SZJingjia Micro (景嘉微)AI acceleratorsDesigns GPU chips, including the reported JM9 series, and sells them as semiconductor products, operating as a China-listed fabless design house that relies on external foundries for production. Listed on the Shenzhen Stock Exchange (ChiNext) under ticker 300474.300474.SZJingruiMaterialsJingrui Electronic Materials (晶瑞电材), founded in 2001 and headquartered in Suzhou and listed on Shenzhen ChiNext (300655), supplies two semiconductor product groups — g/i-line and KrF photoresist with matching yellow-room chemicals, and high-purity wet chemicals led by hydrogen peroxide and sulfuric acid — plus NMP-based lithium-battery materials, with Big Fund Phase II among its investors. FY2025 revenue was RMB 1.61 billion (+12.2%) with attributable net profit of RMB 149 million, a swing from a RMB 180 million loss in 2024, driven by high-purity chemicals (+19.3%) and KrF photoresist sales up more than 70%.300655.SZJingsheng Equipment (晶升装备)OtherZhejiang company founded December 2006 and listed on ChiNext in May 2012 (300316.SZ), built on mono-crystal silicon growth furnaces (China's first fully automatic unit in 2007) for photovoltaic customers, now diversified across silicon, sapphire and silicon-carbide crystal growth and processing equipment plus compound substrates and consumables. FY2025 revenue was RMB 11.36B with net profit RMB 885M (-64.7% YoY) as photovoltaic capex collapsed, while integrated-circuit and SiC-related equipment and materials revenue reached RMB 1.85B with over RMB 3.7B of unfulfilled contracts at year-end.688478.SSJingyi Equipment (京仪装备)OtherBeijing state-owned supplier of semiconductor support equipment: temperature-control units (recirculating chillers) for diffusion/CVD/etch tools, process exhaust-gas abatement systems, and wafer transfer equipment. Listed on the STAR Market on 2023-11-29 (688652.SS) as the first STAR listing of Beijing Jingyi Group (Beijing SASAC / Beijing Enterprises control system). FY2025 revenue was RMB 1.43B (+38.95% YoY); net profit RMB 148M (-3.26% YoY).688652.SSJingzhida (精智达)OtherShenzhen Jingzhida (SEICHITECH), founded in 2011 and listed on the STAR Market in 2023 (688627), runs a dual strategy of AMOLED display inspection equipment and semiconductor memory test equipment. Its DRAM wafer/final-test systems are tightly bound to CXMT (长鑫存储), where it is reported as exclusive domestic supplier of HBM testers; memory test became its largest business (55.51% of main revenue) in FY2025 with revenue of RMB 1.128 billion (+40.46%).688627.SSJinhaitong (金海通)OtherTianjin-based maker of IC test handlers (tri-temperature pick-and-place handlers under the EXCEED series) sold to OSATs, test subcontractors, IDMs and fabless designers in China and abroad. Listed on the Shanghai Stock Exchange main board in February 2023 under 603061.SH. FY2025 revenue rebounded sharply to RMB 698M (+71.68% YoY) on recovering packaging-and-test equipment demand.603061.SSKingsemi (芯源微)OtherKingsemi designs, manufactures, and sells semiconductor front-end and advanced-packaging process equipment, primarily photoresist coater/developer track systems and related cleaning and stripping tools. Revenue comes from tool sales to integrated device manufacturers, foundries, packaging houses, and compound semiconductor/LED producers, supplemented by aftermarket service, spare parts, and process support.688037.SSKunlunxinAI acceleratorsKunlunxin sits in AI accelerators. This is the most visible layer in AI compute, but the chip alone is only part of the stack.PrivateLanjian Electronics (蓝箭电子)Assembly & testLanjian Electronics (蓝箭电子, 301348.SZ), based in Foshan, Guangdong, packages and sells discrete devices — transistors, diodes and MOSFETs — and power-management ICs, running its own brand alongside contract packaging services. Its roots go back to Foshan Radio Factory No. 4 in the early 1970s, with the company registered in December 1998.301348.SZLeadmicro (微导纳米)OtherWuxi-based vacuum thin-film deposition equipment maker centered on atomic layer deposition (ALD), with product lines spanning ALD, CVD and etch tools for photovoltaic cells, integrated circuits, compound-semiconductor power devices and emerging applications. Listed on the STAR Market in December 2022 (688147.SS). FY2025 revenue was RMB 2.63B (-2.47% YoY) as photovoltaic demand fell, while semiconductor equipment revenue jumped 169% to RMB 881M, becoming the largest growth engine.688147.SSLiyang Chip (利扬芯片)Assembly & testLiyang Chip operates an independent (third-party) semiconductor testing business, providing outsourced IC test services to fabless design houses and IDMs rather than manufacturing its own chips. Revenue is earned from test service fees as customers outsource wafer probing and finished-product testing instead of maintaining in-house test floors.688135.SSLongsys ElectronicsMemoryLongsys is a Chinese memory and storage company that packages and brands NAND flash and DRAM components into modules, cards, drives, and other storage products for consumer and enterprise markets. Its Lexar brand covers consumer storage accessories. Revenue is driven by storage-product sales and is highly sensitive to the memory pricing cycle.301308.SZLoongson TechnologyCPUFabless CPU and SoC designer that develops its own LoongArch instruction set architecture and general-purpose processor cores, selling chips and IP into China's domestic computing market.688047.SSMaxio Technology (联芸科技)MemoryMaxio (联芸科技) is a Hangzhou fabless chip designer founded in November 2014 that supplies consumer, enterprise and industrial SSD controller chips plus AIoT signal-processing chips, backed by Hikvision and supplying Longsys and YMTC. It listed on the STAR Market in November 2024 (688449) — the first STAR IPO after the new 'National Nine Articles' rules — reaching a market value above RMB 23 billion. FY2024 revenue was RMB 1.174 billion with net profit of about RMB 118 million.688449.SSMaxscendAnalog / powerMaxscend Microelectronics (江苏卓胜微电子股份有限公司), founded in Wuxi, Jiangsu on August 10, 2012 and listed on ChiNext in June 2019 (300782.SZ), is China's leading RF front-end supplier of switches, LNAs, filters, PAs and RF modules for Android smartphones including Samsung and Xiaomi. Its Xinzhuo (芯卓) fab project - a 6-inch SAW line now in full-category volume production - is moving the company from fabless to fab-lite, pressuring margins as revenue declined in 2025.300782.SZMetaXAI acceleratorsMetaX (沐曦) is a Shanghai GPU startup founded in September 2020 by ex-AMD engineer Chen Weiliang. It designs general-purpose GPUs across four product families with its self-developed MXMACA software stack, and listed on the STAR Market on 2025-12-17 at RMB 104.66/share, with first-day gains of about 693% pushing market value above RMB 300 billion. Its 曦云 C500 training GPU, benchmarked against the Nvidia A100, generated over 70% of revenue.688802.SSMontage TechnologyConnectivityMontage Technology is a Shanghai-based fabless designer of memory-interface and interconnect chips — DDR5 register clock drivers, PCIe retimers, and CXL memory controllers — plus the Jintide server CPU platform. It is dual-listed on the STAR Market (688008) and, since January 2026, HKEX (6809).688008.SSMoore ThreadsAI acceleratorsDesigns and markets GPUs and related solutions for graphics and compute workloads, including a virtual desktop infrastructure (VDI) offering; monetizes through chip and board/card hardware plus associated software and solution integration.688795.SSMotorcommConnectivityFabless semiconductor company that designs and sells networking silicon, including switching chips, and is listed on the Shanghai Stock Exchange STAR Market (688515).688515.SSNata Opto-electronicMaterialsJiangsu Nata Opto-Electronic Material, founded December 2000 in Suzhou from Nanjing University MO-source technology under the national 863 Program and 02 Special Project, listed on Shenzhen ChiNext in August 2012. It is the world's only company mass-producing the full range of metal-organic (MO) sources with over 40% global share, and the only Chinese company simultaneously mass-producing MO sources, electronic specialty gases, ALD precursors and ArF (193nm) photoresist. FY2025 revenue was RMB 2.59 billion with net profit of RMB 320 million, up 18% year over year.300346.SZNational SiliconMaterialsNational Silicon Industry Group (NSIG, 沪硅产业), founded 2015 in Shanghai and listed on the STAR Market in April 2020, is mainland China's flagship silicon-wafer platform: subsidiary Shanghai Xinsheng pioneered domestic 300mm wafer mass production, Xinao Technology is China's largest SOI producer, and Finland's Okmetic (acquired 2016) adds specialty and SOI wafers. FY2025 revenue reached RMB 3.72 billion (+9.7%) on 300mm volume growth of about 27%, but pricing pressure drove an attributable net loss of RMB 1.51 billion. End-2025 300mm capacity stood at 850,000 wafers per month with 1.2 million planned.688126.SSNationzMCUNationz Technologies, established in Shenzhen in March 2000 out of the national '909' IC engineering program and listed on ChiNext in 2010 (300077.SZ), focuses on general-purpose MCUs, security chips, battery-management and Bluetooth/RF chips. It also runs an artificial-graphite anode-materials business through Inner Mongolia Sinuo and Hubei Sinuo subsidiaries. In March 2026 the company completed an A+H dual listing, raising about HK$944 million net on the Hong Kong main board (02701.HK).300077.SZNAURA Technology GroupDeposition / etchNAURA Technology Group is China's largest semiconductor equipment maker and the closest thing the country has to a broad-platform tool vendor: etch, deposition, oxidation/diffusion furnaces, and cleaning under one roof. CINNO Research ranked it the world's #6 equipment maker by 2024 sales.002371.SZNetac Technology (朗科科技)MemoryNetac (深圳市朗科科技股份有限公司) was founded in 1999 in Shenzhen by Deng Guoshun and Cheng Xiaohua, who invented the world's first USB flash drive and filed the foundational patent (ZL99117225.6) in November 1999; that patent expired in November 2019. Netac listed on the ChiNext board on January 8, 2010 (300042). Today it sells consumer and enterprise storage products - SSDs, memory modules, embedded and mobile storage - and licenses a portfolio of more than 300 patents; since April 2022 its controlling shareholder has been Shaoguan Urban Investment (24.89% via judicial auction), making the Shaoguan municipal SASAC the actual controller. FY2025 revenue was RMB 1.24 billion (+49.46%), returning to profit, and H1 2026 revenue doubled to RMB 966 million.300042.SZNexchip SemiconductorFoundryNexchip (Hefei JC Semiconductors) was established in May 2015 in Hefei, Anhui, as the province's first 12-inch pure-play wafer foundry, built with technology cooperation from Taiwan's PSMC (力晶科技), which managed the company until the end of 2019. It listed on the STAR Market on May 5, 2023 (688249) and completed an H-share listing in Hong Kong (2249.HK) on July 10, 2026 at HK$32.30 per share. Nexchip is the world's largest foundry for display driver chips (DDIC) with a 23.3% global share and ranks third in China with about 8.7% of domestic foundry revenue (FY2025). Nodes span 150nm to 28nm; FY2025 revenue was RMB 10.89 billion (+17.69%).688249.SSNovosense MicroelectronicsAnalog / powerNovosense develops and sells analog, sensor-interface, and power-management integrated circuits for automotive and industrial applications under a fabless model, earning revenue from IC sales to system OEMs and their suppliers.688052.SSNucleiIP coresLicenses RISC-V processor IP cores, platform subsystems, and associated development software to integrated circuit designers and SoC development teams on a design-license and royalty model typical of processor IP companies.PrivatePayton TechnologyAssembly & testIdentity confirmed: Payton Technology (Shenzhen) Co., Ltd. (沛顿科技（深圳）有限公司) is a memory packaging and test company, not a substrate maker. Founded in July 2004 as the wholly foreign-owned enterprise of US-based Kingston Technology, it was acquired 100% by Shenzhen Kaifa Technology (深科技, 000021.SZ) in 2015 for about US$110mm and is now described as the largest domestic-invested high-end memory packaging and test enterprise, with sites in Shenzhen, Dongguan and Hefei.PrivatePhytiumCPUDesigns and sells domestically developed Feiteng (飞腾) processors built on Arm-compatible architecture, serving Chinese government, national-project, and key industrial customers as a domestic-substitution CPU supplier.PrivatePiotechDeposition / etchPiotech is a Chinese semiconductor equipment supplier focused on thin-film deposition tools, one of the non-lithography equipment categories China needs to qualify inside domestic fabs.688072.SSPNCS (至纯科技)OtherShanghai-based PNC Process Systems (至纯科技), founded in 2000 and listed on the SSE in January 2017, supplies high-purity gas/chemical delivery systems, wet-cleaning equipment (via subsidiary 至微科技), electronic materials and fab services to China's top fabs. FY2024 revenue was RMB 3.605 billion (+14.40%) with new orders of RMB 5.577 billion; it launched the S300-D wet tool in 2024 and targets 12-inch single-wafer cleaning localization.603690.SSPrimariusEDAPrimarius is a Shanghai-listed Chinese EDA company best known for device modeling, SPICE/FastSPICE simulation, PDK-related tools, and analog/custom design enablement.688206.SSPuya Semiconductor (普冉股份)MemoryPuya Semiconductor (Shanghai) was founded in January 2016 in Shanghai's Zhangjiang hub and listed on the STAR Market in August 2021 (688766). A fabless designer, it is one of China's leading suppliers of NOR Flash and EEPROM, which together made up 68.02% of FY2025 main-business revenue, and it extends from 'storage' into 'storage+' products such as 32-bit MCUs and memory-plus-analog combos. FY2025 revenue reached a record RMB 2.32 billion (+28.62%). In 2025-2026 Puya acquired SLC NAND supplier SHM (a former SK hynix/Cypress joint venture, fourth-largest SLC NAND vendor globally in 2024) through its controlled platform Noah Changtian, moving toward full ownership.688766.SSQipai Technology (气派科技)Assembly & testQipai Technology (气派科技, 688216.SH), founded in Shenzhen in 2006 with main operations in Dongguan, is a small-to-mid packaging and test house centered on traditional and mid-range formats such as SOP, SOT, DFN/QFN and DIP/QFP, plus its self-defined CPC package family. It has recorded net losses each year from 2022 through 2025 as pricing in mature packaging stayed weak.688216.SSRoboSenseLidar / radarRoboSense designs, manufactures, and sells LiDAR sensor hardware and perception solutions for automotive advanced driver-assistance systems (ADAS), autonomous vehicles, and increasingly for robotics applications. Revenue comes from lidar unit sales and related software, with AI robotics positioned as a strategic growth frontier.2498.HKSemiconductor Manufacturing International Corp (SMIC)FoundrySMIC is mainland China's largest pure-play foundry and the single most important company in any assessment of Chinese chip self-sufficiency: if a Chinese-designed chip is going to be manufactured domestically, SMIC is usually the first — and often the only — realistic answer.0981.HKSemitronixEDAHangzhou company founded in 2003 selling yield-improvement EDA software (test-chip design), circuit IP, WAT high-speed electrical test equipment and semiconductor data analytics, listed on ChiNext in August 2022 (301095.SZ). FY2025 revenue was RMB 735M (+34.40% YoY) with net profit of RMB 88.7M; software development and licensing revenue grew 75.13% to RMB 278M.301095.SZSeyondLidar / radarSeyond designs and manufactures lidar sensors and end-to-end lidar solutions, primarily for automotive ADAS and autonomous driving applications. Revenue comes from hardware sales to automakers and through a channel partner network.2665.HKSG MicroAnalog / powerSG Micro is a fabless semiconductor company that designs and sells high-performance analog integrated circuits — spanning power management, signal chain, and interface products — to electronics OEMs and manufacturers. Revenue is generated from IC product sales, while wafer fabrication, packaging, and test are outsourced to foundry and OSAT partners.300661.SZShanghai Micro Electronics Equipment (SMEE)LithographySMEE is China's leading domestic lithography scanner maker, founded in Shanghai in March 2002 under a Ministry of Science and Technology and Shanghai government initiative. Its SSX600 front-end series tops out at the SSA600/20 with 90nm resolution in production use, while its 28nm-capable ArF immersion SSA/800-10W has been described in media reports since 2023-2025 without official company confirmation. It was placed on the US Unverified List in February 2022 and the Entity List in December 2022.PrivateSiCarrierLithographySiCarrier, founded August 2021 in Shenzhen under the Shenzhen municipal government's Major Industry Investment Group (SASAC-owned), is China's most aggressive state-backed entrant into fab equipment: it unveiled 31 mass-production tools across six categories (etch, diffusion, thin film, and physical/X-ray/optical metrology) at SEMICON China in March 2025, and by September 2025 held over RMB 10 billion in orders with a new funding round near close at a pre-money valuation of RMB 65 billion. The US Commerce Department added SiCarrier to the Entity List on 2024-12-05 as part of its crackdown on China's indigenous toolmaking.PrivateSICCOtherSICC is a Chinese silicon-carbide substrate supplier, relevant to the materials layer behind EV power semiconductors, industrial power electronics, and RF devices.688234.SSSilan MicroAnalog / powerHangzhou Silan Microelectronics, founded in September 1997 and listed on the Shanghai Stock Exchange since March 2003 as the first mainland-listed IC design company, operates as an IDM spanning chip design, 5-inch/6-inch/8-inch/12-inch wafer fabrication, compound semiconductors and packaging. Its IPM intelligent power modules dominate Chinese white-goods inverter designs, and it is scaling SiC MOSFETs for electric-vehicle main-drive inverters plus a planned CNY 10 billion 12-inch analog fab.600460.SSSilergyAnalog / powerSilergy Corp, founded in 2008 by Silicon Valley engineers and incorporated in the Cayman Islands with its main operating subsidiary in Hangzhou, China, designs power management ICs, power modules and battery management ICs for automotive, industrial, communications and consumer applications. It has been listed on the Taiwan Stock Exchange (6415.TW) since December 2013, an unusual mainland-rooted, Taiwan-listed structure. Revenue reached NT$18.45 billion in 2024, up about 20% year over year.6415.TWSino WealthMCUSino Wealth Electronic, founded in Shanghai in July 1994 and listed on Shenzhen ChiNext in June 2012 (300327.SZ), is one of China's longest-standing fabless MCU suppliers. It built its base in custom MCUs for Chinese home-appliance makers and now focuses on industrial-grade MCUs (smart appliances, motor control, metering, IoT), lithium-battery management chips and AMOLED display driver chips, with smart-appliance MCUs shipping in rising volume to overseas-brand customers.300327.SZSIZONECMP polishing toolsHangzhou Sizone Electronic Technology (众硅科技), founded May 2018 in Hangzhou with a core team from Silicon Valley, builds high-end CMP equipment including its six-platen 12-inch TTAIS 300 tool, slurry delivery systems and ECMP. It is one of the few Chinese companies with mass-production 12-inch CMP technology. In December 2025 AMEC (中微公司) announced a share-issuance acquisition of about 64.69% of Sizone for roughly RMB 1.576 billion — an implied total valuation of RMB 2.436 billion — and the deal was submitted for registration in May 2026 as the first case under the STAR Market's simplified M&A review.PrivateSJ SemiconductorAdvanced packagingIdentity confirmed: SJ Semiconductor Co., Ltd. is 盛合晶微半导体（江阴）有限公司, formerly 中芯长电半导体有限公司, founded in November 2014 in Jiangyin, Jiangsu as an SMIC-JCET joint venture announced in August 2014 to build China's first 12-inch bumping line; SMIC sold its 55.87% stake for US$397mm in 2021 and the company was renamed. It is China's pioneer in 12-inch mid-end (bumping/RDL) processing and chiplet multi-die integration, ranked the world's tenth-largest OSAT by Gartner for 2024. Its STAR Market IPO was accepted on October 30, 2025 with a planned raise of RMB 4.8bn and it passed the listing review in February 2026.688820.SSSkyverse Technology (中科飞测)OtherShenzhen Skyverse (中科飞测), founded December 2014 and listed on the STAR Market in July 2022 (688361) as the first domestic inspection/metrology equipment IPO, builds optical defect-inspection and metrology tools used by SMIC, YMTC and other fabs. FY2025 revenue reached RMB 2.053 billion (+48.75%) with a first attributable net profit of RMB 57.71 million; in 2025 it expanded into e-beam and X-ray inspection.688361.SSSmartSensImage sensorsFabless semiconductor company that designs CMOS image sensor (CIS) chips and outsources wafer fabrication, packaging, and testing to foundry and OSAT partners. Revenue comes from selling finished sensor devices into security and surveillance, automotive, smartphone, and machine-vision end markets.688213.SSSouthchipAnalog / powerShanghai-based fabless designer of charging and battery-management ICs, founded August 2015 and listed on the STAR Market April 7, 2023 (688484). Its charge-pump fast-charging chips made it the domestic leader in phone charging silicon, with customers including Xiaomi, OPPO, vivo, Honor, Lenovo, Anker and Belkin. Revenue grew from RMB 108mm in 2019 to RMB 3.261bn in 2025.688484.SSStarPower SemiconductorOtherStarPower is a Chinese power-semiconductor company focused on IGBT modules and adjacent power devices, directly tied to EV, industrial inverter, renewable-energy, and motor-drive substitution.603290.SSTechwinsemi (德明利)MemoryShenzhen Techwinsemi (德明利) was founded in 2008 in Shenzhen and listed on the Shenzhen Stock Exchange main board on July 1, 2022 (001309); it is a national-level 'little giant' specialization enterprise. It designs storage controller chips and builds storage modules - SSDs, embedded storage (eMMC), memory modules and mobile storage - for consumer, industrial, automotive and data-center uses, adapting products to domestic CPU platforms. FY2025 revenue crossed RMB 10 billion for the first time (RMB 10.79 billion, +126.07%), and its July 2026 forecast for H1 2026 was net profit of RMB 5.7-6.5 billion on revenue of RMB 16-18 billion as AI demand drove memory prices up.001309.SZTongfu MicroelectronicsAdvanced packagingTongfu Microelectronics is one of mainland China's major OSAT companies, with an unusually important AMD-linked advanced-packaging footprint through Suzhou and Penang operations.002156.SZV-Test (伟测科技)Assembly & testV-Test (伟测科技, 688372.SH), founded in Shanghai in 2016, is a leading mainland independent third-party IC test house offering wafer test (CP), final test (FT), system-level test and burn-in from four test centers in Shanghai, Wuxi, Nanjing and Shenzhen. Revenue reached RMB 1.58 billion in 2025, up 46.22% YoY.688372.SSVeriSiliconIP coresVeriSilicon is a Shanghai-listed semiconductor IP and custom-silicon design platform. It is best tracked as a design-services and IP node, not as a volume chip supplier.688521.SSWanye Enterprise (万业企业)OtherShanghai-listed company (600641.SS, listed 1993) that transformed from real estate into semiconductor equipment and materials. Its subsidiary Compart/凯世通 (Kaishitong, founded 2009, consolidated since 2018) builds ion implanters covering low-energy high-current, high-energy and medium-current types with volume processes to 28nm; subsidiary Jiaxin Semiconductor (嘉芯, founded 2021 with Dr. Zhang Rujing) makes etch and deposition tools. Controlling shareholder changed to Xiandao Technology Group (朱世会) in November 2024, and the company was renamed from Wanye Enterprises to Xiandao Jidian in November 2025.600641.SSWill Semiconductor / OmniVisionOtherWill Semiconductor, now branded OmniVision Group, is a Shanghai-headquartered fabless semiconductor company built around CMOS image sensors, analog/discrete products, and OmniVision's global image-sensor franchise.603501.SSWingtechOtherWingtech is a Shanghai-listed electronics integration company whose semiconductor importance comes mainly through Nexperia, the Dutch discrete/logic/MOSFET supplier it acquired in 2019.600745.SSXpeedicEDAXpeedic, founded 2010 in Shanghai by Dr. Feng Ling and Dai Wenliang (both EDA-industry veterans of Synopsys, Cadence and Mentor), provides full-stack chip-package-system EDA spanning SI/PI, electromagnetic and electro-thermal simulation, integrated passive devices and a Chiplet advanced-packaging platform. It raised over seven rounds (January 2021 B round above RMB 100 million, investors include China Fortune/SMIC's 中芯聚源 and SAIC), saw an Empyrean 100% acquisition plan announced March 2025 and terminated July 2025, and completed CITIC-sponsored A-share IPO tutoring in December 2025. Revenue reached RMB 265 million in 2024 with net profit of RMB 48 million.PrivateYandong Micro (燕东微)FoundryBeijing Yandong Microelectronics, with roots back to 1987 and among Beijing's oldest chip enterprises, operates as an IDM across chip design, wafer fabrication, packaging and test. It listed on the STAR Market in November 2022 (688172); controlling shareholder Beijing Electronics Control (北京电控) holds 45.23%, with the national IC fund holding roughly 11%. Its business spans discrete devices and analog ICs, special ICs, and open foundry plus packaging/test services on 6-inch, 8-inch and 12-inch lines. FY2025 revenue was RMB 1.83 billion (+7.56%) with an attributable net loss of RMB 408 million as the new 12-inch lines ramp; the first-phase 12-inch line passed 20K wafers per month at end-2025.688172.SSYMTCMemoryYMTC is China's leading NAND flash maker: a Wuhan-based memory company whose Xtacking 3D NAND roadmap is one of the clearest tests of Chinese semiconductor progress under U.S. tool restrictions.PrivateYoke TechnologyMaterialsYixing, Jiangsu-based materials company founded October 1997 as a flame-retardant chemicals producer and listed on the Shenzhen Stock Exchange in May 2010, rebuilt itself through acquisitions into a semiconductor materials platform: Korea's UP Chemical (precursors), Chengdu Kemetec (fluorinated specialty gases), Huafei Electronics (silica/silicon powders) and LG Chem's color photoresist assets, alongside its original LNG insulation composite board business. FY2025 revenue reached RMB 8.611bn (86.11亿), up 25.49% year over year.002409.SZYongsi Electronics (甬矽电子)Assembly & testYongsi Electronics (甬矽电子, 688362.SH), based in Ningbo's Yuyao district, is a packaging and test house founded in 2017 that works exclusively in mid- and high-end advanced packaging such as SiP, flip-chip and wafer-level products. Revenue grew from RMB 3.61 billion in FY2024 to RMB 4.40 billion in FY2025.688362.SSZTE MicroelectronicsConnectivityA fabless semiconductor design subsidiary inside ZTE that designs custom communication and consumer SoCs, primarily consumed internally by ZTE's carrier networks, enterprise, and consumer-device businesses, with limited external merchant-chip sales.Private