Company at a glance
Scale
Revenue up 141% since FY2023
Growth prospects
Expanding customer base and product roadmap
FY2025 revenue about 6.52B CNY (+58.87% YoY); trailing-twelve-month revenue about 6.92B CNY (+59.50% YoY); Q1 2026 revenue about 1.11B CNY (+56.97% Y…IPO/prospectus-era disclosures described tools used at 14nm and above, with testing below 10nm.China competition
Competes with NAURA, SiCarrier, AMEC, ACM Research in Deposition / etch — peers listed at sector level.
SubstituteGlobal comparables
Global reference set: Applied Materials, Lam Research, Tokyo Electron.
Applied Materials, Lam Research, Tokyo Electron, ASM International, and Kokusai Electric by process-tool category.Technical gap
Sector rated substitute vs the frontier.
Obstacles
US export-control exposure
Added to the U.S. Entity List in December 2024.All sourced facts (10)
- Headquarters: Shenyang, Liaoning.
- Employees: Approximately 1,695 employees (as reported by data provider)
- Revenue / scale: FY2025 revenue about 6.52B CNY (+58.87% YoY); trailing-twelve-month revenue about 6.92B CNY (+59.50% YoY); Q1 2026 revenue about 1.11B CNY (+56.97% YoY)
- Market cap / valuation: Market cap about 234.15B CNY (SSE STAR Market, 688072)
- Listing status: Shanghai Stock Exchange STAR Market (科创板) · 688072 · A-share common stock (par value RMB 1.00)
- Founded: Founded in 2010 in Shenyang, Liaoning.
- Listing: Listed on the Shanghai STAR Market as 688072 in 2022.
- Core tools: PECVD, ALD, and SACVD deposition equipment.
- Process-node signal: IPO/prospectus-era disclosures described tools used at 14nm and above, with testing below 10nm.
- Export controls: Added to the U.S. Entity List in December 2024.
About
Sells thin-film deposition equipment — PECVD, ALD, and SACVD systems — plus service and spares to Chinese fabs. STAR Market-listed (688072) since 2022; reported FY2025 revenue of about RMB 6.5B; added to the U.S. Entity List in December 2024.
Shenyang, Liaoning · Founded 2010 · Ticker 688072
Why it matters
Deposition is a core fab process step. Piotech matters because domestic fabs cannot localize capacity with lithography alone; they also need production-qualified deposition tools, service depth, recipes, and repeat orders.
Where it sits in the stack
Key semiconductor products
- Plasma-enhanced chemical vapor deposition (PECVD) systems.
- Atomic layer deposition (ALD) systems.
- Sub-atmospheric chemical vapor deposition (SACVD) systems.
- High-end semiconductor equipment industrialization project announced in 2024 with RMB 1.1B planned investment.·2024
- Thin-film deposition (CVD) equipment
Financials
688072.SS · Shanghai STAR Market 688072 · via Yahoo Finance ↗
Financial trajectory via annual filings via Yahoo Finance
RMB billionsMarket data refreshed daily; annual figures from exchange filings. Figures in the reporting currency shown on the chart.
Ecosystem
Investors / affiliates
- Piotech
- 沈阳新松半导体设备 (新松半导体)
- 新松半导体
Competitors
- Applied Materials
- Lam Research
- Tokyo Electron
Customers / end markets
- Reported customer exposure includes major China fabs such as SMIC, Hua Hong, YMTC, and CXMT in earlier public descriptions; each customer/program should be treated as source-specific rather than universal qualification
- End markets are indirect: logic, memory, power, and specialty chips depend on fab tool adoption rather than Piotech selling into end devices
Global peer set
- Applied Materials, Lam Research, Tokyo Electron, ASM International, and Kokusai Electric by process-tool category
- Chinese peers include AMEC, NAURA, ACM Research, Piotech, Hwatsing, and other tool specialists by step
Affiliates
- Wholly-owned subsidiaries: 拓荆创益(沈阳)半导体设备有限公司, 拓荆科技(上海)有限公司, 上海岩泉科技
Competitive position
- Piotech belongs in the deposition-tool slice of the equipment map, not the broad 'semiconductor equipment' bucket.
- The relevant comparison set is Applied Materials, Lam Research, Tokyo Electron, ASM International, and other deposition suppliers, depending on the exact film and process step.
- A tool vendor should be judged by fab qualification, repeat orders, uptime/service, critical-layer use, and process coverage, not by a product brochure.
- Adoption bottleneck is fab qualification at advanced nodes and reliance on imported precision subsystems/materials.
- Global comparables: Applied Materials, Lam Research, Tokyo Electron, ASM International, and Kokusai Electric by process-tool category.
- Global comparables: Chinese peers include AMEC, NAURA, ACM Research, Piotech, Hwatsing, and other tool specialists by step.
- Critical dependencies include RF power, vacuum systems, precision components, process recipes, chamber materials, sensors, and field-service depth.
- Entity List status can constrain U.S.-origin components and know-how, while also increasing domestic substitution pressure from Chinese fabs.
Recent activity
- 2025-09-13—Disclosed 2025 private A-share placement plan (预案) on SSE STAR Market. [via big5.sse.com.cn]
- 2025—Added to SSE 180 Index adjustment list and ranked #2 reserve constituent for the SSE STAR 50 Index. [via english.sse.com.cn]
- 2024-05-10—Related-party co-investment: subsidiary 上海岩泉科技 to invest RMB 15.00 million for 1.0714% of 沈阳新松半导体设备 (新松半导体). [via star.sse.com.cn]
Milestones and signals
- 2010—Piotech was founded.
- 2026-10-04—Market cap: RMB 187B
- FY2025—Revenue: RMB 6.5B
- FY2025—Net Profit: RMB 927M
- Listing—Shanghai Stock Exchange STAR Market (科创板) · 688072 · A-share common stock (par value RMB 1.00)
What to watch
- PECVD, ALD, and SACVD order flow by fab type.
- RMB 1.1B industrialization-base project execution.
- Customer qualification at SMIC, Hua Hong, YMTC, CXMT, and other domestic fabs.
- Entity List workarounds and domestic component localization.
Answered questions
Last reviewed 2026-07-01Which Piotech tools are qualified in production, and at what process steps?
On the record: in etch, thin-film deposition, and ion implant processes across the semiconductor manufacturing chain (Commercial use) at vacuum transfer platforms) and in front-end (FEOL) and back-end (BEOL) semiconductor wafer fabrication (Commercial use) at Core business is thin-film deposition equipment (incl. CVD).
Are deployments limited to noncritical/mature layers, or are any tools used in advanced-node or memory-critical layers?
On the record: in etch, thin-film deposition, and ion implant processes across the semiconductor manufacturing chain (Commercial use) at vacuum transfer platforms) and in front-end (FEOL) and back-end (BEOL) semiconductor wafer fabrication (Commercial use) at Core business is thin-film deposition equipment (incl. CVD).
How much revenue comes from initial tool sales versus service, spares, and repeat fab orders?
A tool vendor should be judged by fab qualification, repeat orders, uptime/service, critical-layer use, and process coverage, not by a product brochure.
Which subcomponents remain import-sensitive after the 2024 Entity List action?
Adoption bottleneck is fab qualification at advanced nodes and reliance on imported precision subsystems/materials. Critical dependencies include RF power, vacuum systems, precision components, process recipes, chamber materials, sensors, and field-service depth.