Company at a glance
Scale
Revenue up 25% since FY2023
Growth prospects
Expanding customer base and product roadmap
~RMB 1.234 billion main-business revenue (2009)China competition
Competes with JCET, Huatian, SJ Semiconductor, SMIC ecosystem in Advanced packaging — peers listed at sector level.
SubstituteGlobal comparables
Global reference set: TSMC, ASE, Amkor.
ASE and Amkor for global OSAT scale and advanced packaging.Technical gap
Sector rated substitute vs the frontier.
Obstacles
US export-control exposure
not found in reviewed sources.All sourced facts (11)
- Founded: 1997
- Headquarters: Nantong, Jiangsu, China.
- Employees: 7000+ technical/management staff (date not specified on site)
- Revenue / scale: ~RMB 1.234 billion main-business revenue (2009)
- Listing status: Shenzhen Stock Exchange · 002156 · A-share (简称 通富微电)
- Public listing: Shenzhen Stock Exchange (SZSE) / 002156 / A-share, par value RMB1.00.
- Founding lineage: Origins trace to Nantong Transistor Factory in 1966; Tongfu/Nantong Fujitsu joint-venture history began in 1997.
- Listing year: Listed on the Shenzhen Stock Exchange in 2007.
- AMD transaction: In 2015, AMD agreed to sell majority stakes in Suzhou and Penang assembly/test operations to Nantong Fujitsu/Tongfu for about US$371M; the JV structure was 85% Tongfu and 15% AMD.
- Scale marker: Reported employee count was 19,975 in 2023.
- Sanctions / export controls: not found in reviewed sources.
About
Outsourced semiconductor assembly and test: packaging, wafer-level/package-level assembly, final test, and advanced-packaging services for fabless and IDM customers. Tongfu is a back-end services node in the ecosystem rather than a chip designer.
Nantong · Founded 1997 · Ticker 002156
Why it matters
Tongfu matters because advanced packaging is one route around front-end process limits, and its AMD-linked history makes it unusually relevant to high-performance computing packaging rather than only commodity assembly.
Where it sits in the stack
Advanced packaging
2.5D/3D integration, interposers, HBM attach, thermal management, substrate supply, and yield.
Assembly & test (OSAT)
High-end package complexity, global customer mix, test equipment access, and advanced substrate supply.
Key semiconductor products
- Substrate BGA/CSPBGA
- WLP / 2.5D/3D
- FC/FCBGA
- SiP
- Lead-frame·BCC/LQFP
- Memory packaging
- Test services
- Package assembly
- Final test
- Advanced packaging
- AMD-linked packaging operations
- Reported HBM-related packaging watch item
Financials
002156.SZ · Shenzhen Stock Exchange 002156 · via Yahoo Finance ↗
Financial trajectory via annual filings via Yahoo Finance
RMB billionsMarket data refreshed daily; annual figures from exchange filings. Figures in the reporting currency shown on the chart.
Ecosystem
Customers / end markets
- STMicroelectronics
- Fujitsu
- Infineon Technologies
- Freescale
- Fujitsu (related party)
- Innofidei (Beijing)
- AMD-linked Suzhou and Penang operations are the highest-confidence relationship signal
- End-market exposure includes HPC, memory, automotive electronics, new energy, consumer electronics, and communications; AMD is the only publicly confirmed marquee customer
Partners
- AMD
- CXMT
Competitors
- ASE Technology
Global peer set
- ASE and Amkor for global OSAT scale and advanced packaging
- JCET and Huatian for domestic OSAT topology
Affiliates
- Historical Fujitsu affiliation (related party, 2012)
- Nantong Huada Microelectronics Group
- TF AMD Microelectronics Penang
- Suzhou Tongfu Chaowei
Competitive position
- China position: Leading / Near frontier in selected advanced-packaging exposure, especially because of AMD-linked assets.
- Global reference companies: ASE, Amkor, JCET, Powertech, Huatian, and SPIL depending on package category.
- Strength metric: advanced-package mix, AMD/JV revenue exposure, HBM/AI packaging signals, high-end test capability, and customer qualification.
- Major China OSAT with unusually important AMD-linked Suzhou/Penang assets; frontier rating depends on package family and customer program, not the company name alone.
- Advanced substrates, HBM stack integration, thermal management, high-end test, and customer-specific qualification.
- Global comparables: ASE and Amkor for global OSAT scale and advanced packaging.
- Global comparables: JCET and Huatian for domestic OSAT topology.
- Advanced packaging constraints include substrates, bumping, test equipment, thermal management, HBM stack integration, and customer-specific qualification.
Milestones and signals
- 1997—Tongfu Microelectronics was founded.
- 2023—Employees: 19,975
- 2026-10-04—Market cap: RMB 90.7B
- FY2025—Revenue: RMB 27.9B
- Listing—Shenzhen Stock Exchange · 002156 · A-share (简称 通富微电)
What to watch
- 2026-01 to 2026-04: 2026 A-share private placement (向特定对象发行A股股票) sponsored by 国泰海通证券, new issuance capped at 30% of pre-issuance shares
- Any shift in control by Nantong Huada Microelectronics Group (南通华达微电子集团股份有限公司), the controlling shareholder.
- The AMD joint-venture sites in Suzhou (苏州通富超威) and Penang (TF AMD Microelectronics) and their loading.
Questions
Last reviewed 2026-07-01Answered questions
What share of revenue comes from AMD-related subsidiaries and advanced packaging?
Revenue: RMB 27.9B (FY2025).
Is the reported HBM/CXMT work pilot, customer validation, or volume production?
On the record: Automotive SiP packaging R&D line (Prototype) at Government-funded program for Automotive SiP and IC packaging/testing services (Commercial use) at ST Microelectronics Pte Ltd.
Open questions
- Which package families and test capabilities are actually qualified for HPC customers?