Company at a glance
Scale
Revenue up 37% since FY2023
Growth prospects
Expanding customer base and product roadmap
via stcn.com ↗Revenue RMB 3.66 billion (+9.66%); attributable net profit RMB 720 million (+38.32%); R&D spend RMB 519 millionvia wap.eastmoney.com ↗China's largest domestic CMP pad provider with 38.5% share of the China market by 2025 revenue and China's third-largest CMP materials provider overa…China competition
Competes with Hwatsing, GEGV (Jingyi Jingwei), SIZONE, Anji Microelectronics in CMP polishing tools — peers listed at sector level.
Close behindGlobal comparables
Global reference set: Applied Materials, Ebara.
DuPont (CMP pads global leader)Technical gap
Sector rated close behind vs the frontier.
Obstacles
Sector bottleneck applies
Advanced-node process coverage, endpoint detection, ultra-uniform polishing, cleaning, consumable consistency, and long fab qualification cycles.Official filings: Eastmoney: HK filing and Frost & Sullivan share data (Jul 2026) ↗ · Sina Finance: FY2025 annual report (segment detail) ↗ · EET-China: H-share prospectus coverage incl. pad revenue +52% ↗ · H-share filing ↗
All sourced facts (11)
- Listing status: Shenzhen Stock Exchange · 300054.SZ · A-share (300-prefix, ChiNext board)
- Founded / HQ / listing: Founded 2000, headquartered in Wuhan Economic & Technological Development Zone; listed on Shenzhen ChiNext in 2010 (300054.SZ) via dl-kg.com ↗
- FY2025 results: Revenue RMB 3.66 billion (+9.66%); attributable net profit RMB 720 million (+38.32%); R&D spend RMB 519 million via stcn.com ↗
- Market position: China's largest domestic CMP pad provider with 38.5% share of the China market by 2025 revenue and China's third-largest CMP materials provider overall (Frost & Sullivan) via wap.eastmoney.com ↗
- CMP pads revenue: FY2025 CMP pad revenue RMB 795 million, up 52% year over year (per H-share filing coverage) via eet-china.com ↗
- Business mix shift: Semiconductor materials reached about 57% of 2025 revenue, with the CMP solutions share rising from 37.9% to 56.3% via app.myzaker.com ↗
- Capacity: Wuhan base with 400,000 hard pads (rough polish) per year plus Qianjiang base with 200,000 soft pads (finish polish) and buffer pads per year; June 2026 launch of a third soft-pad line in Qianjiang targeting glass-substrate CMP pads and large-size pads via whkfq.gov.cn ↗
- Adjacent lines: CMP slurry and cleaning solutions revenue RMB 119 million in H1 2025 (+55.22%); advanced packaging materials FY2025 revenue RMB 11.76 million entering volume ramp; OLED coating-type functional materials domestic share 38.5% via money.finance.sina.com.cn ↗
- H-share filing: July 2026: filed a main-board listing application with the Hong Kong Stock Exchange toward an A+H structure via whkfq.gov.cn ↗
- Capital returns: August 2026: announced a share buyback of RMB 100-200 million at up to RMB 128 per share; market capitalization has exceeded RMB 100 billion via data.eastmoney.com ↗
- Competitive backdrop: Global CMP pad market led by DuPont (79% global share in 2016); global pad market about US$1.38 billion, pads plus slurry about US$3.38 billion via wap.eastmoney.com ↗
About
Platform materials company that develops and mass-produces CMP pads (hard/rough-polish in Wuhan, soft/finish-polish and buffer pads in Qianjiang), CMP slurries and cleaning solutions, semiconductor display materials (OLED coating-type functional materials with 38.5% domestic share), advanced-packaging materials and printing-consumables (25,000 tonnes polymer toner capacity), selling to Chinese fabs and global printer/display OEMs.
Founded 2000 · Ticker 300054.SZ
Why it matters
CMP pads and slurries are a roughly US$3.4 billion global consumables market where DuPont (79% global pad share in 2016) and Cabot/CMC have long led; Dinglong is the only Chinese CMP pad maker capable of batch substitution at Chinese fabs, giving SMIC/CXMT/YMTC-class customers a domestic second source precisely as equipment localization accelerates.
Where it sits in the stack
CMP polishing equipment
Advanced-node process coverage, endpoint detection, ultra-uniform polishing, cleaning, consumable consistency, and long fab qualification cycles.
Materials: wafers, photoresist, gases, CMP
High-purity inputs, advanced photoresists, repeatability, qualification cycles, and dependence on Japanese/US specialty suppliers.
Key semiconductor products
- Semiconductor display materialsOLED coating-type functional materials (38.5% domestic share)
- Advanced packaging materials·temporary adhesives and related, entering volume
- Printing imaging consumablescharge control agents and polymer toner (25,000 t/y capacity)
- CMP polishing pads
- CMP slurry
Financials
300054.SZ · Shenzhen ChiNext 300054.SZ · via Yahoo Finance ↗
Financial trajectory via annual filings via Yahoo Finance
RMB billionsMarket data refreshed daily; annual figures from exchange filings. Figures in the reporting currency shown on the chart.
Ecosystem
Global peer set
- DuPont (CMP pads global leader)
- Cabot / CMC (slurry leader)
- Resonac, Fujimi, 3M (abrasives/consumables)
- Anji Microelectronics (domestic slurry peer, 688019.SH)
Competitive position
- China's number-one domestic CMP pad supplier (38.5% China share by 2025 revenue) and the only Chinese pad maker in batch substitution against DuPont
- China's number-three CMP materials provider overall; expanding from pads into slurry/cleaning to contest Cabot-class positions
- Market capitalization above RMB 100 billion in 2026, among Hubei's largest listed companies
- Positioned in CMP consumables per market-report search footprint.
- Global comparables: DuPont (CMP pads global leader)
- Global comparables: Cabot / CMC (slurry leader)
- Global comparables: Resonac, Fujimi, 3M (abrasives/consumables)
- Global comparables: Anji Microelectronics (domestic slurry peer, 688019.SH)
Milestones and signals
- 2000—Dinglong Co. was founded.
- 2025—CMP Pad Capacity: 400,000 hard pads/year (Wuhan) + 200,000 soft pads/year (Qianjiang)
- 2025—China CMP Pad Market Share (Domestic Providers, By Revenue): 38.5%
- 2026-10-04—Market cap: RMB 64.4B
- FY2025—Revenue: RMB 3.7B
- Listing—Shenzhen Stock Exchange · 300054.SZ · A-share (300-prefix, ChiNext board)
What to watch
- Hong Kong listing progress after the July 2026 filing and use of proceeds for overseas pad/slurry expansion
- Glass-substrate CMP pads — the new Qianjiang line targets panel-level/glass-core packaging demand
- CMP pad capacity utilization divergence flagged in the H-share prospectus coverage
- Slurry and cleaning-solution growth rate versus the pad base
Questions
Last reviewed 2026-07-11Answered questions
What is the measurable gap versus global reference companies?
Against DuPont (CMP pads global leader), Cabot / CMC (slurry leader), Resonac, Fujimi, 3M (abrasives/consumables), and Anji Microelectronics (domestic slurry peer, 688019.SH): Positioned in CMP consumables per market-report search footprint.
Open questions
- Which products are qualified beyond pilots in materials?
- Which customers, fabs, or end markets show real adoption rather than policy interest?