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China Wafer Level CSP (晶方科技)晶方科技

603005Reviewed 2026-08-30

The company provides wafer-level chip-scale packaging (WLCSP) and related advanced packaging services to semiconductor design and manufacturing customers, earning revenue from packaging and assembly service fees.

Scale

~$205.1Mrevenue FY2025 · CNY 1.5B
~$2.4Bmarket cap · 2026-10-04

Gap vs frontier

Close behindsector position

Sector-level position; no priceable accelerator silicon to compare chip-by-chip.

China Wafer Level CSP (晶方科技): close behind tier in Assembly & test (OSAT), ~$205.1M FY2025 revenue.

The chip stackEach layer depends on the layers below it
1 · ChipsWhat the stack produces
2 · Design toolsSoftware and IP to design them
3 · ManufacturingPlants that turn designs into silicon
Assembly & test · Close behind
4 · EquipmentMachines inside the plants
5 · MaterialsWhat the plants consume

Company at a glance

Scale

Revenue up 61% since FY2023

Growth prospects

Revenue trajectory FY2023–2025

China competition

Competes with JCET, Tongfu Microelectronics, Huatian, SJ Semiconductor in Assembly & test — peers listed at sector level.

Close behind

Global comparables

Global reference set: ASE, Amkor, JCET.

Technical gap

Sector rated close behind vs the frontier.

Obstacles

Sector bottleneck applies

High-end package complexity, global customer mix, test equipment access, and advanced substrate supply.
All sourced facts (1)
  • Listing status: Shanghai Stock Exchange (SSE) · 603005 · A-share

Why it matters

China Wafer Level CSP (晶方科技) is China's dedicated wafer-level chip-scale packaging (WLCSP) specialist, occupying a distinct niche in the advanced OSAT layer where device miniaturization drives packaging demand. Its edge is concentrated WLCSP expertise; the test ahead is whether it can scale wafer-level packaging capacity and technology into higher-volume, higher-density applications at Chinese fabless and sensor customers, rather than serving only mature commodity packaging steps.

Where it sits in the stack

Manufacturing

Assembly & test (OSAT)

Close behind

High-end package complexity, global customer mix, test equipment access, and advanced substrate supply.

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Key semiconductor products

  • Wafer-level chip-scale packaging·WLCSP

Financials

603005.SS · Shanghai Stock Exchange (main board) 603005.SS · via Yahoo Finance ↗

Financial trajectory via annual filings via Yahoo Finance

RMB billions
RMB 0.91BRMB 0.15B
2023
RMB 1.13BRMB 0.25B
2024
RMB 1.47BRMB 0.37B
2025

Market data refreshed daily; annual figures from exchange filings. Figures in the reporting currency shown on the chart.

Competitive position

  • Core technology is WLCSP; specific pitch density, node-level capability, and competitive comparison are not reported in available sources.

Milestones and signals

  • 2026-10-04—Market cap: RMB 17.6B
  • FY2025—Revenue: RMB 1.5B
  • FY2025—Net Profit: RMB 370M
  • Listing—Shanghai Stock Exchange (SSE) · 603005 · A-share

What to watch

  • New product releases with disclosed specifications.
  • Customer qualification, design-win, or volume-use signals.
  • Revenue, capacity, shipment, market-share, or valuation updates.
  • Export-control, supply-chain, or tooling constraints.

Questions

Last reviewed 2026-07-11

Answered questions

What is the measurable gap versus global reference companies?

Core technology is WLCSP; specific pitch density, node-level capability, and competitive comparison are not reported in available sources.

Open questions

  • Which products are qualified beyond pilots in OSAT?
  • Which customers, fabs, or end markets show real adoption rather than policy interest?