Company profiles›Lanjian Electronics (蓝箭电子)

Lanjian Electronics (蓝箭电子)蓝箭电子

301348Reviewed 2026-08-30

Lanjian Electronics (蓝箭电子, 301348.SZ), based in Foshan, Guangdong, packages and sells discrete devices — transistors, diodes and MOSFETs — and power-management ICs, running its own brand alongside contract packaging services. Its roots go back to Foshan Radio Factory No. 4 in the early 1970s, with the company registered in December 1998.

Scale

~$99.1Mrevenue FY2025 · CNY 0.7B
~$722.6Mmarket cap · 2026-10-04

Gap vs frontier

Close behindsector position

Sector-level position; no priceable accelerator silicon to compare chip-by-chip.

Lanjian Electronics (蓝箭电子): close behind tier in Assembly & test (OSAT), ~$99.1M FY2025 revenue.

The chip stackEach layer depends on the layers below it
1 · ChipsWhat the stack produces
2 · Design toolsSoftware and IP to design them
3 · ManufacturingPlants that turn designs into silicon
4 · EquipmentMachines inside the plants
5 · MaterialsWhat the plants consume

Company at a glance

Scale

Revenue down 3% since FY2023

Growth prospects

Expanding customer base and product roadmap

via wap.eastmoney.com ↗Revenue of RMB 713 million in 2024, down 3.19% YoY; net profit attributable of RMB 15.1 million, down 74.11% YoY amid a mild power-semiconductor reco…via wap.eastmoney.com ↗Revenue of RMB 712 million in 2025, down 0.15% YoY; a net loss attributable of RMB 37.4 million as slow consumer and industrial demand and price pres…

China competition

Competes with JCET, Huatian, SJ Semiconductor, China Wafer Level CSP in Assembly & test — peers listed at sector level.

Close behind

Global comparables

Global reference set: ASE, Amkor, JCET.

Amkor Technology (US)

Technical gap

Sector rated close behind vs the frontier.

Obstacles

Sector bottleneck applies

High-end package complexity, global customer mix, test equipment access, and advanced substrate supply.

Official filings: FY2025 annual report (Sina disclosure) ↗

All sourced facts (7)
  • Listing status: SZSE · 301348 · A-share (ChiNext)
  • Founding and HQ: Registered on December 30, 1998, in Foshan, Guangdong, as successor to Foshan Radio Factory No. 4 (established in the early 1970s); completed shareholding reform in 2012; chairman Zhang Shun (张顺). via baike.baidu.com ↗
  • Listing: Listed on the Shenzhen Stock Exchange ChiNext board on August 10, 2023 (301348.SZ), issuing 50 million shares at RMB 18.08 each; Foshan's 79th listed company. via 21jingji.com ↗
  • FY2024 results: Revenue of RMB 713 million in 2024, down 3.19% YoY; net profit attributable of RMB 15.1 million, down 74.11% YoY amid a mild power-semiconductor recovery. via wap.eastmoney.com ↗
  • FY2025 results: Revenue of RMB 712 million in 2025, down 0.15% YoY; a net loss attributable of RMB 37.4 million as slow consumer and industrial demand and price pressure outweighed higher shipment volumes. via wap.eastmoney.com ↗
  • First-half 2026 recovery: Revenue of RMB 422 million in the first half of 2026, up 24.52% YoY, with a return to net profit of RMB 3.0 million. via wap.eastmoney.com ↗
  • Products and customers: Products span power and small-signal transistors, diodes and MOSFETs plus power-management ICs (AC-DC, DC-DC, battery protection) in TO, SOT, SOD, DFN and SOP packages, applied in consumer electronics, home appliances, industrial and automotive electronics; contract-packaging clients include Toppower (拓尔微), China Resources Micro (华润微) and Bright Power (晶丰明源), while own-brand parts go into Midea (美的) and Gree (格力) appliances. via vip.stock.finance.sina.com.cn ↗

About

Sells own-brand discrete devices to appliance makers such as Midea (美的) and Gree (格力), and provides contract packaging and test to chip companies including Toppower (拓尔微), China Resources Micro (华润微) and Bright Power (晶丰明源).

Ticker 301348

Why it matters

It is a representative mid-tier mainland discrete packager spanning TO, SOT, SOD, DFN and SOP formats; its 2025 swing to a loss and 2026 first-half recovery track the fierce price competition across China's power-semiconductor tail.

Where it sits in the stack

Key semiconductor products

  • Own-brand discrete devicespower and small-signal transistors, diodes and MOSFETs
  • Contract packaging and test in TO, SOT, SOD, DFN and SOP formats
  • Power-management ICsAC-DC, DC-DC and battery-protection chips
  • Semiconductor assembly, packaging, and testing

Financials

301348.SZ · Shenzhen ChiNext 301348.SZ · via Yahoo Finance ↗

Financial trajectory via annual filings via Yahoo Finance

RMB billions
RMB 0.74BRMB 0.06B
2023
RMB 0.71BRMB 0.02B
2024
RMB 0.71BRMB -0.04B
2025

Market data refreshed daily; annual figures from exchange filings. Figures in the reporting currency shown on the chart.

Ecosystem

Global peer set

  • Amkor Technology (US)
  • UTAC (Singapore)

Competitive position

  • A mid-tier player straddling own-brand discretes and OSAT services; appliance makers Midea and Gree buy its own-brand parts while China Resources Micro and Bright Power use its packaging services
  • Competes with Yangjie Electronics (扬杰科技) and China Resources Micro's in-house packaging in mainstream discrete formats
  • Not assessable from available signals; source snippets were empty.
  • Global comparables: Amkor Technology (US)
  • Global comparables: UTAC (Singapore)

Milestones and signals

  • 2026-10-04—Market cap: RMB 5.2B
  • FY2025—Revenue: RMB 712M
  • FY2025—Net Profit: RMB -37.4M
  • Listing—SZSE · 301348 · A-share (ChiNext)

What to watch

  • Durability of the 2026 first-half recovery after the 2025 loss
  • Pricing environment for consumer discretes and appliances demand
  • Migration toward DFN-family, SiP and automotive-grade discrete packaging

Questions

Last reviewed 2026-07-11

Answered questions

What is the measurable gap versus global reference companies?

Against Amkor Technology (US) and UTAC (Singapore): Not assessable from available signals; source snippets were empty.

Open questions

  • Which products are qualified beyond pilots in OSAT?
  • Which customers, fabs, or end markets show real adoption rather than policy interest?