Company profiles›Jiaocheng Ultrasonic (骄成超声)

Jiaocheng Ultrasonic (骄成超声)骄成超声

688392Founded 2007ShanghaiReviewed 2026-08-30

SBT (Jiaocheng) Ultrasonic Technology, founded in Shanghai in February 2007 by a core team from Shanghai Jiao Tong University and listed on the STAR Market in September 2022 (688392.SS), builds ultrasonic welding, cutting and inspection equipment for lithium-battery manufacturing, automotive wire harnesses and power semiconductors. Its ultrasonic rolling welders are supplied to CATL for battery-tab welding, and its semiconductor line - aluminum and copper wire bonders, terminal and pin welders, and ultrasonic scanning microscopes - grew revenue 196% in 2024, targeting a market led by K&S and ASMPT.

Scale

~$107.7Mrevenue FY2025 · CNY 0.8B
~$2.5Bmarket cap · 2026-10-04

Gap vs frontier

—gap not quantified

Jiaocheng Ultrasonic (骄成超声).

Company at a glance

Scale

Revenue up 47% since FY2023

Growth prospects

Expanding customer base and product roadmap

via time-weekly.com ↗Semiconductor ultrasonic-equipment revenue reached CNY 46.93 million in 2024, up 196% year over yearvia vzkoo.com ↗Revenue grew 32.4% in 2025 with gross margin rising to 63.43%, aided by high-margin accessories and semiconductor/harness businesses

Official filings: 2025 annual report (CNINFO) ↗

All sourced facts (8)
  • Listing status: Shanghai Stock Exchange STAR Market (科创板) · 688392 · A-share
  • Founded: February 2007, Shanghai (Minhang district); core technology team from Shanghai Jiao Tong University; MIIT 'specialized little giant' enterprise via sbt-sh.com ↗
  • Listing: Shanghai STAR Market, 688392.SS, September 2022 via futunn.com ↗
  • CATL relationship: Ultrasonic rolling-weld machines supplied to CATL for lithium-battery tab welding, where ultrasonic welding offers energy-saving advantages and is difficult to replace via cloud.tencent.com ↗
  • Semiconductor equipment breakout: Semiconductor ultrasonic-equipment revenue reached CNY 46.93 million in 2024, up 196% year over year via time-weekly.com ↗
  • Semiconductor product line: Aluminum-wire and copper-wire ultrasonic bonders, ultrasonic terminal welders, pin welders and ultrasonic scanning microscopes; global wire-bonding is led by K&S and ASMPT with Germany's Hesse leading ultrasonic precision bonding via static.cninfo.com.cn ↗
  • FY2025 performance: Revenue grew 32.4% in 2025 with gross margin rising to 63.43%, aided by high-margin accessories and semiconductor/harness businesses via vzkoo.com ↗
  • Q1 2026: Revenue of about CNY 200 million, up 34%, with net profit of CNY 50.3 million, up about 113% via wap.hibor.com.cn ↗

About

Designs and sells ultrasonic equipment, tooling and spare parts plus integrated solutions, with recurring accessories revenue; serves battery makers, automotive and appliance harness suppliers, and power-semiconductor/IGBT module manufacturers.

Shanghai · Founded 2007 · Ticker 688392

Why it matters

Jiaocheng demonstrates how a domestic battery-equipment specialist is leveraging ultrasonic process know-how into semiconductor die- and wire-bonding tools, a segment dominated by K&S, ASMPT and Germany's Hesse. Its 63% gross margin and fast semiconductor growth make it a credible domestic challenger in back-end power-module assembly equipment.

Where it sits in the stack

equipment

Key semiconductor products

  • Automotive wire-harness, terminal and pin ultrasonic welders
  • Ultrasonic scanning microscopes·acoustic inspection
  • Welding accessories, tooling and monitoring systems
  • Ultrasonic equipment and systems·specific categories pending confirmation

Financials

688392.SS · Shanghai STAR Market 688392.SS · via Yahoo Finance ↗

Financial trajectory via annual filings via Yahoo Finance

RMB billions
RMB 0.53BRMB 0.07B
2023
RMB 0.58BRMB 0.09B
2024
RMB 0.77BRMB 0.12B
2025

Market data refreshed daily; annual figures from exchange filings. Figures in the reporting currency shown on the chart.

Ecosystem

Global peer set

  • Kulicke & Soffa (K&S)
  • ASMPT
  • Hesse Mechatronik
  • Schunk
  • Telsonic
  • Branson (Emerson)

Competitive position

  • Leading domestic supplier of ultrasonic welding equipment to Chinese battery makers including CATL
  • Domestic challenger in ultrasonic wire bonding for IGBT/power modules, a niche led globally by Hesse with the broader wire-bond market led by K&S and ASMPT
  • Power-semiconductor customers include Zhenhua Technology and CRRC Times Electric
  • Unclear; depends on whether ultrasonic tools target production-critical semiconductor manufacturing or packaging steps.
  • Global comparables: Kulicke & Soffa (K&S)
  • Global comparables: ASMPT
  • Global comparables: Hesse Mechatronik
  • Global comparables: Schunk

Milestones and signals

  • 2007—Jiaocheng Ultrasonic (骄成超声) was founded.
  • 2026-10-04—Market cap: RMB 18.1B
  • FY2025—Revenue: RMB 774M
  • FY2025—Net Profit: RMB 118M
  • Listing—Shanghai Stock Exchange STAR Market (科创板) · 688392 · A-share

What to watch

  • Conversion of semiconductor bonder orders into volume shipments at automotive-grade IGBT/SiC module makers
  • Battery-equipment demand cyclicality as CATL and peers adjust capacity
  • Gross-margin durability as the mix shifts toward equipment over accessories

Questions

Last reviewed 2026-07-11

Answered questions

What is the measurable gap versus global reference companies?

Leading domestic supplier of ultrasonic welding equipment to Chinese battery makers including CATL.

Open questions

  • Which products are qualified beyond pilots in equipment?
  • Which customers, fabs, or end markets show real adoption rather than policy interest?