Company at a glance
Scale
Private, not exchange-listed
Growth prospects
Expanding customer base and product roadmap
via pedaily.cn ↗TTAIS 300, a six-platen 12-inch CMP machine, cited as evidence Sizone is among the few Chinese firms mastering high-end 12-inch CMP technology in mas…China competition
Competes with Hwatsing, GEGV (Jingyi Jingwei), Anji Microelectronics, Dinglong Co. in CMP polishing tools — peers listed at sector level.
Close behindGlobal comparables
Global reference set: Applied Materials, Ebara.
Applied Materials (Reflexion)Technical gap
Sector rated close behind vs the frontier.
Obstacles
Sector bottleneck applies
Advanced-node process coverage, endpoint detection, ultra-uniform polishing, cleaning, consumable consistency, and long fab qualification cycles.All sourced facts (8)
- Founded / HQ: Founded May 2018, headquartered in Hangzhou; positioning as a high-end CMP equipment company with a Silicon Valley-origin core team via sizonetech.com ↗
- Product focus: 200mm and 300mm (8/12-inch) CMP equipment solutions; products include 6-12 inch CMP tools, single-module CMP systems, slurry delivery systems (SDS) and ECMP (electrochemical mechanical polishing) equipment via sizonetech.com ↗
- Flagship tool: TTAIS 300, a six-platen 12-inch CMP machine, cited as evidence Sizone is among the few Chinese firms mastering high-end 12-inch CMP technology in mass production via pedaily.cn ↗
- Funding history: Roughly nine to ten rounds since inception from investors including Yida Capital, Ningbo Industrial Investment Group, Ling'an Venture Capital, Suzhou Guofa Venture Capital, CITIC Securities Investment, Dacheng Capital, Rongyi Investment, Xingcheng Capital, Baoding Investment, Junhai Chuangxin and AMEC via tianyancha.com ↗
- 2021 round: November 2021: nearly RMB 200 million new round led by Yida Capital with Ningbo Industrial Investment Group, with Xingcheng Capital, Baoding Investment and Junhai Chuangxin among followers, to commercialize 12-inch CMP tools via m.c114.com.cn ↗
- AMEC acquisition: 2025-12-18: AMEC announced plans to acquire control of Sizone via share issuance plus matching fundraising; on about 2025-12-30 the plan was disclosed as roughly 64.69% for about RMB 1.576 billion via cls.cn ↗
- Deal status and valuation: May 2026: the AMEC-Sizone transaction was submitted for registration as the first simplified-review M&A on the STAR Market; the agreement implies an overall Sizone valuation of about RMB 2.436 billion with performance commitments attached via jrj.sh.gov.cn ↗
- Strategic effect: Post-acquisition AMEC becomes the first Chinese equipment vendor with the four core front-end capabilities of etch, thin-film deposition, metrology/inspection and wet-process CMP via cls.cn ↗
About
Venture-backed developer and seller of 200mm/300mm CMP tools and related subsystems (slurry delivery, ECMP) to wafer fabs, funded across roughly nine rounds by state and private investors including AMEC itself; now exiting via acquisition into a listed platform.
Founded 2018
Why it matters
12-inch CMP is a front-end chokestep where Hwatsing has dominated domestic share and Applied Materials and Ebara lead globally; AMEC's purchase of Sizone creates China's first equipment vendor spanning etch, deposition, metrology and wet-process CMP, and the deal's simplified-review first marks a new regulatory lane for semiconductor consolidation.
Where it sits in the stack
Key semiconductor products
- TTAIS 300 six-platen 12-inch (300mm) CMP system
- 6-12 inch single-module CMP systems and 200mm (8-inch) CMP tools
- Slurry delivery systems (SDS) for CMP process lines
- ECMP (electrochemical mechanical polishing) equipment
Ecosystem
Global peer set
- Applied Materials (Reflexion)
- Ebara
- Accretech (TOKYO SEIMITSU)
- Hwatsing 华海清科 (688120.SH, domestic CMP leader with 90%+ of domestic CMP sales per one supply-chain tally)
- GEGV / Jingyi Jingwei (domestic CMP peer)
Competitive position
- One of the few Chinese companies with mass-production 12-inch CMP technology, second domestically to Hwatsing in CMP equipment
- Becoming AMEC's wet-process arm, closing AMEC's gap versus Applied Materials' breadth and pitting the combined entity more directly against Hwatsing
- CXMT/YMTC-driven 2026 equipment tenders (reported up over 35% YoY) are the demand backdrop for domestic CMP orders
- No source content available to assess technology position.
- Not assessable from available signals.
- Global comparables: Applied Materials (Reflexion)
- Global comparables: Ebara
- Global comparables: Accretech (TOKYO SEIMITSU)
Milestones and signals
- 2018—SIZONE was founded.
- 2021—November 2021 Financing Round: CNY Nearly RMB 200 million
- 2025—Implied Equity Valuation (With Performance Commitments): CNY About RMB 2.436 billion
- 2025—Acquisition Consideration (AMEC For ~64.69%): CNY About RMB 1.576 billion
What to watch
- Registration completion and closing of the AMEC acquisition (submitted May 2026)
- Sizone's delivered performance commitments under the deal
- 12-inch CMP tool shipments into CXMT/YMTC-class expansion tenders
- Hwatsing's response, including its ECMP and international patent disputes
Questions
Last reviewed 2026-07-11Answered questions
What is the measurable gap versus global reference companies?
Against Applied Materials (Reflexion), Ebara, Accretech (TOKYO SEIMITSU), and Hwatsing 华海清科 (688120.SH, domestic CMP leader with 90%+ of domestic CMP sales per one supply-chain tally): No source content available to assess technology position.
Open questions
- Which products are qualified beyond pilots in equipment?
- Which customers, fabs, or end markets show real adoption rather than policy interest?