Company at a glance
Scale
Revenue up 34% since FY2023
Growth prospects
Expanding customer base and product roadmap
via dataclouds.cninfo.com.cn ↗First in mainland China and among the global top three in display-driver chip packaging and testing by revenue, per the FY2024 annual report; roughly…via money.finance.sina.com.cn ↗Display-driver customers include Novatek (联咏科技), Chipone (集创北方), FocalTech (敦泰电子), Himax (奇景光电), Raydium (瑞鼎科技), Parade (谱瑞科技), Solomon Systech (晶门科技…China competition
Competes with JCET, Tongfu Microelectronics, Huatian, SJ Semiconductor in Assembly & test — peers listed at sector level.
Close behindGlobal comparables
Global reference set: ASE, Amkor, JCET.
Chipbond Technology (Taiwan)Technical gap
Sector rated close behind vs the frontier.
Obstacles
Sector bottleneck applies
High-end package complexity, global customer mix, test equipment access, and advanced substrate supply.Official filings: www1.hkexnews.hk ↗ · www1.hkexnews.hk ↗ · www1.hkexnews.hk ↗ · www1.hkexnews.hk ↗
All sourced facts (6)
- Founding and HQ: Founded in 2004 in Suzhou with investment from Taiwan's Chipbond (颀邦科技); the listed entity, Hefei Chipmore Technology Co., Ltd. (合肥颀中科技股份有限公司), is headquartered in Hefei, Anhui, with a wholly-owned Suzhou subsidiary at Suzhou Industrial Park. via chipmore.com.cn ↗
- Listing: Listed on the Shanghai Stock Exchange STAR Market on April 20, 2023 under code 688352.SH. via chipmore.com.cn ↗
- Market rank: First in mainland China and among the global top three in display-driver chip packaging and testing by revenue, per the FY2024 annual report; roughly 18.45 billion display-driver chips were packaged and tested in 2024. via dataclouds.cninfo.com.cn ↗
- Key customers: Display-driver customers include Novatek (联咏科技), Chipone (集创北方), FocalTech (敦泰电子), Himax (奇景光电), Raydium (瑞鼎科技), Parade (谱瑞科技), Solomon Systech (晶门科技), ESWIN Computing (奕斯伟计算) and Yunyinggu (云英谷). via money.finance.sina.com.cn ↗
- Employees: 2,192 employees at end-2024 (288 parent company, 1,904 subsidiaries), rising to 2,416 at end-2025. via money.finance.sina.com.cn ↗
- Capacity expansion: A 2025 convertible bond plan targets gross proceeds of RMB 850 million for a high-density micro-size advanced packaging test platform (RMB 419 million) and phase-two advanced bumping and test expansion at its Anhui unit (RMB 431 million); an SSE review inquiry dated July 7, 2025 was answered on August 5, 2025. via money.finance.sina.com.cn ↗
About
Sells turnkey display-driver IC packaging and test, plus packaging for power-management, RF-front-end and power devices, to fabless driver-IC designers such as Novatek (联咏), Raydium (瑞鼎), Himax (奇景光电) and Chipone (集创北方).
Why it matters
Display drivers are one of the few chip categories where mainland China has built a nearly complete domestic chain, and Chipmore is the largest mainland packaging link in that chain as well as a bellwether for AMOLED driver localization.
Where it sits in the stack
Key semiconductor products
- Display-driver IC full-process packaging and testgold and advanced bumping, CP wafer test, COG glass flip-chip and COF film flip-chip packaging
- Packaging and test for power-management ICs, RF front-end chips and power devices
- Advanced packaging processes including BGBM/FSM, Cu-Clip and flip-chip variants·2025 convertible-bond projects·2025
Financials
688352.SS · Shanghai STAR Market 688352.SS · via Yahoo Finance ↗
Financial trajectory via annual filings via Yahoo Finance
RMB billionsMarket data refreshed daily; annual figures from exchange filings. Figures in the reporting currency shown on the chart.
Ecosystem
Global peer set
- Chipbond Technology (Taiwan)
- ChipMOS Technologies (Taiwan)
Competitive position
- First in mainland China and top three globally in display-driver IC packaging and test revenue (FY2024 annual report), ahead of mainland peer Huicheng (汇成股份)
- Competes with Taiwan's Chipbond and ChipMOS for global display-driver OSAT share
- Specific packaging technologies and node capabilities not available from provided signals.
- Whether Chipmore can move into advanced packaging and qualify at leading Chinese fabs is the key strategic question.
- Global comparables: Chipbond Technology (Taiwan)
- Global comparables: ChipMOS Technologies (Taiwan)
Milestones and signals
- 2023—Listed on the Shanghai Stock Exchange STAR Market on April 20, 2023 under code 688352.SH.
- 2024—FY2024 Display-Driver Packages Tested: CNY 18.45 billion units
- 2025—Headcount: CNY 2,416 employees
- 2026-10-04—Market cap: RMB 20.4B
- FY2025—Revenue: RMB 2.2B
What to watch
- Net profit fell 15.16% to RMB 265.8 million in FY2025 despite revenue growth of 11.78%, reflecting depreciation and product-mix pressure
- RMB 850 million convertible-bond projects for micro-size packaging and advanced bumping capacity
- Hefei R&D center opened at the company's 20th anniversary in 2024, adding to Suzhou development resources
Questions
Last reviewed 2026-07-11Answered questions
What is the measurable gap versus global reference companies?
Against Chipbond Technology (Taiwan) and ChipMOS Technologies (Taiwan): Specific packaging technologies and node capabilities not available from provided signals.
Open questions
- Which products are qualified beyond pilots in OSAT?
- Which customers, fabs, or end markets show real adoption rather than policy interest?