Specifications
Sourced specs
| Spec | Value | Source |
|---|---|---|
| Layers / type | 232-layer TLC 3D NAND, fourth generation | via prnewswire.com ↗2022-08 |
| Density | 1Tbit (128GB) per die, highest in YMTC's history at launch | via reuters.com ↗2022-08-04 |
| I/O speed | Up to 2,400 MT/s, ONFI 5.0 | via allaboutcircuits.com ↗2022-08 |
| Architecture | Xtacking 3.0 (hybrid bonding of CMOS wafer and memory-array wafer); ~50% performance improvement over prior generation | via prnewswire.com ↗2022-08 |
| NAND contract price trajectory | NAND flash contract prices: +20-25% QoQ 4Q25, +55-60% 1Q26, +70-75% 2Q26, +10-15% expected 3Q26 (SLC still +70-75%) | via trendforce.com ↗2026-07-03 |
Pricing
Price history, newest first
No public price observation yet.
vendor-official or multiple independent reports · single major report or several secondary · estimate or lone secondary source
Prices in USD, converted at each observation year's average exchange rate; the original figure and rate print under every converted price. How prices are sourced and graded ↗
Context
Notes
- YMTC does not publish chip pricing; per-GB NAND contract prices (e.g. 512Gb TLC wafer) are TrendForce subscription data, so the public trajectory is captured as quarterly QoQ changes (currency field '%')
- Mass production of 232-layer 3D NAND achieved late 2022 (https://www.techpowerup.com/301629/)
Where it sits
In the stack
All specs and prices link to their original sources, dated as observed. Figures are market observations, not offers; treat each as of its date.