Specifications
Sourced specs
| Spec | Value | Source |
|---|---|---|
| Product status | HBM3 samples delivered to customers by end-2025; full-scale mass production planned 2026 | via x.com ↗2025-05 |
| Capacity allocation | CXMT plans to allocate roughly 20% of its 2026 wafer capacity to HBM3 production | via techpowerup.com ↗2026-01 |
| Schedule risk | Digitimes (April 2026): HBM3 mass production within 2026 now considered unlikely due to low yields and equipment delays | via apps.digitimes.com ↗2026-04-21 |
| HBM3E production start | The Information (Aug 31 2026): CXMT has begun low-volume production of HBM3E, one generation behind Samsung, SK hynix, and Micron (already moving to HBM4 mass production); Alibaba T-Head and Cambricon are testing the chips, with broader availability targeted for 2027 | via investing.com ↗2026-08-31 |
Pricing
Price history, newest first
No public price observation yet.
vendor-official or multiple independent reports · single major report or several secondary · estimate or lone secondary source
Prices in USD, converted at each observation year's average exchange rate; the original figure and rate print under every converted price. How prices are sourced and graded ↗
Context
Notes
- Pricing not publicly disclosed
- No credible spec-level (capacity/bandwidth) or price reporting found; CXMT reportedly delivered 16nm HBM3 samples to Huawei (single secondary source)
- CXMT mass-produced HBM2 at small scale in 2H 2024; original roadmap targeted HBM3 in 2025 and HBM3E by 2027
- August 2026: The Information reports small-batch HBM3E production has started — ahead of the original 2027 roadmap — with low yields and restricted equipment access the remaining constraints
Where it sits
In the stack
All specs and prices link to their original sources, dated as observed. Figures are market observations, not offers; treat each as of its date.