Specifications
Sourced specs
| Spec | Value | Source |
|---|---|---|
| BF16/FP16 compute | 1024 TFLOPS dense / 2048 TFLOPS sparse | via hpcwire.com ↗2022-08-22 |
| INT8 compute | 2048 TOPS | via tomshardware.com ↗2022-08 |
| Memory | 64GB HBM2e (4 stacks, 4096-bit) at ~1.64-2.3 TB/s; OAM QCM variant with 128GB at 3.2 TB/s | via chipsandcheese.com ↗2022-08 |
| TDP | ~550 W, ~1 GHz target clock | via hpcwire.com ↗2022-08-22 |
| Interconnect | PCIe Gen5 with CXL; BLink for OAM-to-OAM | via servethehome.com ↗2022-08 |
| Cache / die | 300MB on-chip cache; 1074 mm2 die | via wccftech.com ↗2022-08 |
Pricing
Price history, newest first
No public price observation yet.
vendor-official or multiple independent reports · single major report or several secondary · estimate or lone secondary source
Prices in USD, converted at each observation year's average exchange rate; the original figure and rate print under every converted price. How prices are sourced and graded ↗
Context
Notes
- Pricing not publicly disclosed; B2B sales only.
- Biren listed in Hong Kong January 2026 (IPO price HK$19.60/share; ~HK$55.83亿 raised); prospectus-derived public reporting disclosed 2024 revenue of 3.37亿元 and average transaction value 940万元 (+113.64% YoY), but no per-chip ASP. Source: https://www.cls.cn/detail/2246285 , https://stcn.com/article/detail/3552949.html
Where it sits
In the stack
All specs and prices link to their original sources, dated as observed. Figures are market observations, not offers; treat each as of its date.