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AI accelerator · China

Ascend 950

Ascend family announced at Huawei Connect in September 2025 as the successor to the 910C, delivering 1 PFLOPS FP8 / 2 PFLOPS FP4 per chip with Huawei's in-house HiBL memory. The inference variant 950PR shipped from Q1 2026; the training variant 950DT follows in Q4 2026.

ChinaShippingHuaweiAscend familyLaunched 2026-01Not disclosed (SMIC advanced node expected)

Pricing not publicly disclosed · researched 2026-08-27

Specifications

Sourced specs

SpecValueSource
FP8 compute1 PFLOPSvia huawei.com2025-09
FP4 compute2 PFLOPSvia huawei.com2025-09
Memory (950PR variant)HiBL 1.0 (self-developed HBM), 128GB, 1.6 TB/svia wccftech.com2025-09
Memory (950DT variant, Q4 2026)HiZQ 2.0, 144GB, 4 TB/svia wccftech.com2025-09
Interconnect2 TB/s scale-up interconnect; Atlas 950 SuperPoD spans 8,192 chips with unified memory addressingvia huawei.com2025-09
ArchitectureHybrid SIMD/SIMTvia huawei.com2025-09

Pricing

Price history, newest first

No public price observation yet.

vendor-official or multiple independent reports · single major report or several secondary · estimate or lone secondary source

Prices in USD, converted at each observation year's average exchange rate; the original figure and rate print under every converted price. How prices are sourced and graded ↗

Context

Notes

  • Pricing not publicly disclosed at family level; only 950PR card variants have reported pricing (see ascend-950pr entry).
  • Roadmap: Ascend 960 (Q4 2027, 2 PFLOPS FP8 / 4 PFLOPS FP4, 288GB, 9.6 TB/s) and Ascend 970 (2028) announced at the same event.

Where it sits

In the stack

All specs and prices link to their original sources, dated as observed. Figures are market observations, not offers; treat each as of its date.